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The Difference between ED Copper and RA Copper

At the heart of flexible printed circuits (FPCs) lies the base material, known as Flexible Copper Clad Laminate (FCCL), comprising Copper combined with Polyimide (PI) or with an additional adhesive layer (AD) and PI. This article delves into the significance of copper selection in FPC fabrication, focusing on Electrodeposited Copper Foil (ED Copper) and Rolled Annealed Copper Foil (RA Copper), elucidating their differences and applications.

IP65-rated PCB assembly based on FR-4 board

Introduction for laminate technology of flexible circuits

The designing difference between rigid circuits and flexible boards

What is flexible circuit board?

The advantages of flexible circuit

Rework and Repair on Flex Circuits

4-layer flexible PCB for LCD cables

IPC Standards from design to end electronic product

The application of FPC

What are the challenges facing the field of PCB inspection?

Another Technological Breakthrough about Extremely Thin Copper Foil

The logo looks like a simple pattern, but it contains a lot of meaning. Many brands have registered their own brand logo design. For them...