Capabilities Of Dual access flex circuits
Parameters | Technical Specifications | UNIT | CAPABILITY | ||
---|---|---|---|---|---|
Limit Tolerance | Normal Tolerance | Remark | |||
Board cutting & thickness |
Layer cutting size: 250mm Min. thickness |
/ mm mm |
1-6 layer 250*1000mm 0.075mm |
1-6 layer 250*500mm 0.10mm |
/ / / |
Other auxiliary material |
Adhesive stiffener hot setting adhesive PI stiffener Other stiffener type |
um um um / |
PSA:50um 12.5/25/40um PI: 1.0-13mil steel, Al, silicon steel sheet |
PSA:50um 12.5/25/40um PI: 1.0-13mil / |
/ / / / |
Drilling |
Min. drilling hole size hole diameter tolerance |
mm mm |
0.1 ±0.075 |
0.2 ±0.1 |
/ / |
PTH | hole wall copper thickness | um | 8/15/25 | 8/15/25 | / |
Exposure |
Min line width/space hole ring offset tolerance Line width tolerance Distance between hole edge to outline |
mm mm mm mm mm |
0.05/0.05 0.125 0.1 ±0.03 ≥0.4 |
0.075/0.075 0.2 0.15 ±0.04 ≥0.5 |
/ / / / |
Lamination |
Coverlay tolerance PI stiffener with outline Sensitive PSA FR4 location tolerance |
mm mm mm mm |
0.15 ±0.3 ±0.3 ±0.3 |
0.2 ±0.3 ±0.3 ±0.3 |
/ / / / |
Ink |
Soler mask thickness Silk screen thickness |
um um |
8 8 |
15 15 |
/ / |
R angle for etching cutting die | mm | 0.5 | 0.5 | / | |
Profile | Steel die tol. |
mm mm |
LS: ±0.075 | LS: ±0.075 | / |
Cutting die tol. |
mm mm |
Etching: ± 0.20 Wooden: ± 0.30 |
Etching: ± 0.20 Wooden: ± 0.30 |
/ | |
Laser tol. Offset tol. for fingers |
mm mm |
± 0.05 ± 0.10 |
± 0.05 ± 0.10 |
/ | |
Surface treatment |
Immersion gold | um |
Ni: 2.0~5.0 Au: 0.03~0.08 |
Ni: 2.0~5.0 Au: 0.03~0.08 |
/ |
Plating tin | um | 8~20 | 8~20 | / |